Heterogeneous Integrations

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other...

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Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Singapore : Springer Nature Singapore : 2019.
Imprint: Springer,
Edition:1st ed. 2019.
Subjects:
Electronics.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Online Access:Full-text access
Description
Summary:Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Physical Description:XXII, 368 p. 386 illus., 342 illus. in color. online resource.
ISBN:9789811372247
DOI:10.1007/978-981-13-7224-7

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