Heterogeneous Integrations

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other...

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Detaylı Bibliyografya
Yazar: Lau, John H. (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Singapore : Springer Nature Singapore : 2019.
Imprint: Springer,
Edisyon:1st ed. 2019.
Konular:
Electronics.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Electronic Circuits and Systems.
Online Erişim:Full-text access
İçindekiler:
  • Chapter 1. Overview of 3D IC Heterogeneous Integrations
  • Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates
  • Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers)
  • Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges)
  • Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates
  • Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking
  • Chapter 7. 3D IC Heterogeneous Integration in PoP Formats
  • Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats
  • Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL
  • Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.

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