APA (7. basım) Alıntı

Lau, J. H. (2018). Fan-Out Wafer-Level Packaging (1st ed. 2018.). Springer Nature Singapore. https://doi.org/10.1007/978-981-10-8884-1

Chicago Style (17. basım) Atıf

Lau, John H. Fan-Out Wafer-Level Packaging. 1st ed. 2018. Singapore: Springer Nature Singapore, 2018. https://doi.org/10.1007/978-981-10-8884-1.

MLA (9th ed.) Atıf

Lau, John H. Fan-Out Wafer-Level Packaging. 1st ed. 2018. Springer Nature Singapore, 2018. https://doi.org/10.1007/978-981-10-8884-1.