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Fan-Out Wafer-Level Packaging
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...
Main Author: | Lau, John H. (Author) |
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Corporate Author: | SpringerLink (Online service) |
Format: | e-Book |
Language: | English |
Published: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2018.
|
Edition: | 1st ed. 2018. |
Subjects: | |
Online Access: | Full-text access View in OPAC |
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