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Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

Detaylı Bibliyografya
Yazar:	Lau, John H. (Yazar)
Müşterek Yazar:	SpringerLink (Online service)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Singapore : Springer Nature Singapore : Imprint: Springer, 2018.
Edisyon:	1st ed. 2018.
Konular:	Electronic circuits. Microtechnology. Microelectromechanical systems. Optical materials. Electronic Circuits and Systems. Microsystems and MEMS. Optical Materials.
Online Erişim:	Full-text access OPAC'ta görüntüle

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