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Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

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Bibliographic Details
Main Author:	Lau, John H. (Author)
Corporate Author:	SpringerLink (Online service)
Format:	e-Book
Language:	English
Published:	Singapore : Springer Nature Singapore : 2018. Imprint: Springer,
Edition:	1st ed. 2018.
Subjects:	Electronic circuits. Microtechnology. Microelectromechanical systems. Optical materials. Electronic Circuits and Systems. Microsystems and MEMS. Optical Materials.
Online Access:	Full-text access

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