Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

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Bibliographic Details
Main Author: Lau, John H. (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Singapore : Springer Nature Singapore : 2018.
Imprint: Springer,
Edition:1st ed. 2018.
Subjects:
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Optical materials.
Electronic Circuits and Systems.
Microsystems and MEMS.
Optical Materials.
Online Access:Full-text access
Table of Contents:
  • Patent Issues of Fan-out Wafer-Level Packaging
  • Flip Chip Technology vs. FOWLP
  • Fan-In Wafer-Level Packaging vs. FOWLP
  • Embedded Chip Packaging
  • FOWLP: Chip-First and Die Face-Down
  • FOWLP: Chip-First and Die Face-Up
  • FOWLP: Chip-Last or RDL-First
  • FOWLP: PoP with FOWLP
  • Fan-Out Panel-Level Packaging (FOPLP)
  • 3D Integration
  • Heterogeneous Integration.

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