APA (7. basım) Alıntı

Huang, Y., Yin, Z., & Wan, X. (2019). Modeling and Application of Flexible Electronics Packaging (1st ed. 2019.). Springer Nature Singapore. https://doi.org/10.1007/978-981-13-3627-0

Chicago Style (17. basım) Atıf

Huang, YongAn, Zhouping Yin, ve Xiaodong Wan. Modeling and Application of Flexible Electronics Packaging. 1st ed. 2019. Singapore: Springer Nature Singapore, 2019. https://doi.org/10.1007/978-981-13-3627-0.

MLA (9th ed.) Atıf

Huang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. 1st ed. 2019. Springer Nature Singapore, 2019. https://doi.org/10.1007/978-981-13-3627-0.