Modeling and Application of Flexible Electronics Packaging

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...

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Detaylı Bibliyografya
Asıl Yazarlar: Huang, YongAn (Yazar), Yin, Zhouping (Yazar), Wan, Xiaodong (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Singapore : Springer Nature Singapore : Imprint: Springer, 2019.
Edisyon:1st ed. 2019.
Konular:
Electronics.
Optical materials.
Manufactures.
Mechanics, Applied.
Computer simulation.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Machines, Tools, Processes.
Engineering Mechanics.
Computer Modelling.
Online Erişim:Full-text access
OPAC'ta görüntüle
Diğer Bilgiler
Özet:This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Fiziksel Özellikler:XVII, 287 p. online resource.
ISBN:9789811336270
DOI:10.1007/978-981-13-3627-0

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