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Modeling and Application of Flexible Electronics Packaging
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...
| Main Authors: | , , |
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| Corporate Author: | |
| Format: | e-Book |
| Language: | English |
| Published: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2019.
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| Edition: | 1st ed. 2019. |
| Subjects: | |
| Online Access: | Full-text access View in OPAC |