APA (7. basım) Alıntı

Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method (1st ed. 2018.). Springer International Publishing. https://doi.org/10.1007/978-3-319-77872-3

Chicago Style (17. basım) Atıf

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Cham: Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.

MLA (9th ed.) Atıf

Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.