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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...
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| Format: | e-Book |
| Language: | English |
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Cham :
Springer International Publishing : Imprint: Springer,
2018.
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| Edition: | 1st ed. 2018. |
| Series: | Springer Series in Advanced Manufacturing,
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| Online Access: | Full-text access View in OPAC |