Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

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Bibliographic Details
Main Author: Seok, Seonho (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2018.
Imprint: Springer,
Edition:1st ed. 2018.
Series:Springer Series in Advanced Manufacturing,
Subjects:
Manufactures.
Nanotechnology.
Microtechnology.
Microelectromechanical systems.
Materials > Analysis.
Coatings.
Tribology.
Machines, Tools, Processes.
Microsystems and MEMS.
Characterization and Analytical Technique.
Online Access:Full-text access
Table of Contents:
  • Overview of MEMS packaging technologies
  • Adhesion control techniques for debonding
  • FEM modeling of debonding
  • Polymer cap transfer packaging technologies
  • Thin film cap transfer packaging technology
  • Other related manufacturing technologies. .

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