Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

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Detaylı Bibliyografya
Yazar: Seok, Seonho (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : Imprint: Springer, 2018.
Edisyon:1st ed. 2018.
Seri Bilgileri:Springer Series in Advanced Manufacturing,
Konular:
Manufactures.
Nanotechnology.
Microtechnology.
Microelectromechanical systems.
Materials > Analysis.
Coatings.
Tribology.
Machines, Tools, Processes.
Microsystems and MEMS.
Characterization and Analytical Technique.
Online Erişim:Full-text access
OPAC'ta görüntüle
İçindekiler:
  • Overview of MEMS packaging technologies
  • Adhesion control techniques for debonding
  • FEM modeling of debonding
  • Polymer cap transfer packaging technologies
  • Thin film cap transfer packaging technology
  • Other related manufacturing technologies. .

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