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More-than-Moore 2.5D and 3D SiP Integration

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the busin...

Detaylı Bibliyografya
Yazar:	Radojcic, Riko (Yazar)
Müşterek Yazar:	SpringerLink (Online service)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : Imprint: Springer, 2017.
Edisyon:	1st ed. 2017.
Konular:	Electronic circuits. Microprocessors. Computer architecture. Electronic Circuits and Systems. Processor Architectures.
Online Erişim:	Full-text access OPAC'ta görüntüle

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