More-than-Moore 2.5D and 3D SiP Integration

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the busin...

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Bibliographic Details
Main Author: Radojcic, Riko (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edition:1st ed. 2017.
Subjects:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Online Access:Full-text access
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Table of Contents:
  • Introduction
  • More-than-Moore Technology Opportunities: 2.5D SiP
  • More-than-Moore Technology Opportunities: 3D SiP
  • More-than-Moore Design Eco-System
  • More-than-Moore Adoption Landscape.

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