Search Results - (( (easy OR past) to (read OR real) materials. ) OR ( (easy OR past) to based materials. ))
Suggested Topics within your search.
Suggested Topics within your search.
- Materials 19
- Analysis 12
- Characterization and Analytical Technique 12
- Polymers 12
- Materials Engineering 9
- Building materials 8
- Mechanics, Applied 7
- Metals 7
- Metals and Alloys 7
- Optical Materials 7
- Optical materials 7
- Signal processing 7
- Signal, Speech and Image Processing 7
- Structural Materials 7
- Biomaterials 6
- Building Materials 6
- Catalysis 6
- Computational Intelligence 6
- Computational intelligence 6
- Electronic Circuits and Systems 6
- Electronic circuits 6
- TECHNOLOGY & ENGINEERING 6
- Telecommunication 6
- Artificial Intelligence 5
- Artificial intelligence 5
- Communications Engineering, Networks 5
- Easy to read materials 5
- Electronics 5
- Electronics and Microelectronics, Instrumentation 5
- Inorganic Chemistry 5
-
1
-
2
The young riders of Mongolia /
Published 2009Subjects: “…Easy to read materials. 27081…”
View in OPAC
Book -
3
Diamond : stories for reading circles /
Published 2009Subjects: “…Easy to read materials. 27081…”
View in OPAC
Book -
4
-
5
-
6
-
7
Gold : stories for reading circles /
Published 2007Subjects: “…Easy to read materials. 27081…”
View in OPAC
Book -
8
Platinium : stories for reading circles /
Published 2009Subjects: “…Easy to read materials. 27081…”
View in OPAC
Book -
9
-
10
-
11
Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /
Published 2018Table of Contents: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
Full-text access
View in OPAC
e-Book -
12
-
13
Polyoxometalate-Based Assemblies and Functional Materials
Published 2018Full-text access
View in OPAC
e-Book -
14
First RILEM International Conference on Concrete and Digital Fabrication - Digital Concrete 2018
Published 2019Table of Contents: “…Toussaint -- A Framework for Performance-based Testing of Fresh Mixtures for Construction-scale 3D Printing, by Ali Kazemian, Xiao Yuan, Ryan Meyer, and Berokh Khoshnevis -- Characterization of 3D Printing Mortars Made With OPC/CSA Mixes, by Noura Khalil, Sébastien Rémond, Bilal Baz, and Georges Aouad -- Rheological and water transport properties of cement pastes modified with diutan gum and attapulgite/palygorskite nanoclays for 3D concrete printing, by Siwei Ma, and Shiho Kawashima -- Rheological Control of 3D Printable Cement Paste and Mortars, by Scott Z. …”
Full-text access
View in OPAC
e-Book -
15
-
16
-
17
Materials Handbook A Concise Desktop Reference /
Published 2018Full-text access
View in OPAC
e-Book -
18
Maritime Spatial Planning past, present, future /
Published 2019Full-text access
View in OPAC
e-Book -
19
Materials for Advanced Packaging
Published 2017Table of Contents: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
Full-text access
View in OPAC
e-Book -
20