Arama Sonuçları - "optoelectronic devices"

Optoelektronik devreler ve sistemler / Yazar: Musayev, Eldar

Konular: OPAC'ta görüntüle

Optimisation of ZnO Thin Films Implants, Properties, and Device Fabrication / Yazar: Nagar, Saurabh, Chakrabarti, Subhananda

İçindekiler: “…Introduction -- Optimisation of PLD Parameters -- Implantation Studies -- Fabrication of Optoelectronics Devices -- Summary and Future Works.…”
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Conjugated polyelectrolytes : fundamentals and applications /

İçindekiler: “…Design and Synthesis of Conjugated Polyelectrolytes / Kan-Yi Pu, Guan Wang, Bin Liu -- All-Conjugated-Diblock Copolymers Containing Conjugated Polyelectrolyte Blocks / Ullrich Scherf, Rachel C Evans, Andrea Gutacker, Guillermo C Bazan -- Ionically Functionalized Polyacetylenes / Stephen G Robinson, Mark C Lonergan -- Aggregation Properties of Conjugated Polyelectrolytes / Hugh D Burrows, Matti Knaapila, Sofia M Fonseca, Telma Costa -- Sensing via Quenching of Conjugated Polyelectrolyte Fluorescence / Danlu Wu, Jie Yang, Fude Feng, Kirk S Schanze -- Sensing Applications via Energy Transfer from Conjugated Polyelectrolytes / Fengting Lv, Shu Wang, Guillermo C Bazan -- Sensing via Conformational Changes of Conjugated Polythiophenes / Even J Lemieux, Mario Leclerc -- Conjugated Polyelectrolyte-Based Biocide Applications / Thomas S Corbitt, Eunkyung Ji, Ying Wang, Anand Parthasarathy, Kristin N Wilde, Eric H Hill, Dimitri Dascier, Heather E Canavan, Eva Y Chi, Kirk S Schanze, David G Whitten -- Conjugated Polyelectrolyte-Based Imaging and Monitoring of Protein Aggregation / K Peter R Nilsson, Per Hammarström -- Charge Injection Mechanism in PLEDs and Charge Transport in Conjugated Polyelectrolytes / Peter Zalar, Thuc-Quyen Nguyen -- Organic Optoelectronic Devices Containing Water/Alcohol-Soluble Conjugated Polymers and Conjugated Polyelectrolytes / Sujun Hu, Chengmei Zhong, Hongbin Wu, Yong Cao -- Optical Processes in Conjugated Polyelectrolytes Dependence on Chain Conformation and Film Morphology / Giuseppina Pace, Richard Friend.…”
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Materials for Advanced Packaging

İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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Advanced Semiconducting Materials and Devices Yazar: Gupta, K.M, Gupta, Nishu

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ZnO-Nanocarbon Core-Shell Type Hybrid Quantum Dots Yazar: Choi, Won Kook

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Principles and Applications of Aggregation-Induced Emission

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