Arama Sonuçları - (( (easy OR past) to (read OR real) materials. ) OR ( (easy OR past) to based materials. ))

The memory man /

Konular: “…Easy to read materials. 27081…”

The young riders of Mongolia /

Konular: “…Easy to read materials. 27081…”

Lost in New York Yazar: Escott, John

Konular: “…Readers (Elementary). Easy to read materials. 35701…”

Diamond : stories for reading circles /

Konular: “…Easy to read materials. 27081…”

Essential Readings in Light Metals, Volume 1, Alumina and Bauxite

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Essential Readings in Light Metals, Volume 2, Aluminum Reduction Technology

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Essential Readings in Light Metals, Volume 3, Cast Shop for Aluminum Production

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Gold : stories for reading circles /

Konular: “…Easy to read materials. 27081…”

Platinium : stories for reading circles /

Konular: “…Easy to read materials. 27081…”

Building Performance Evaluation From Delivery Process to Life Cycle Phases /

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Special education past, present, and future perspectives from the field /

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Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /

İçindekiler: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
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Physics and Chemistry of Carbon-Based Materials Basics and Applications /

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Polyoxometalate-Based Assemblies and Functional Materials

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First RILEM International Conference on Concrete and Digital Fabrication - Digital Concrete 2018

İçindekiler: “…Toussaint -- A Framework for Performance-based Testing of Fresh Mixtures for Construction-scale 3D Printing, by Ali Kazemian, Xiao Yuan, Ryan Meyer, and Berokh Khoshnevis -- Characterization of 3D Printing Mortars Made With OPC/CSA Mixes, by Noura Khalil, Sébastien Rémond, Bilal Baz, and Georges Aouad -- Rheological and water transport properties of cement pastes modified with diutan gum and attapulgite/palygorskite nanoclays for 3D concrete printing, by Siwei Ma, and Shiho Kawashima -- Rheological Control of 3D Printable Cement Paste and Mortars, by Scott Z. …”
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Ultrathin Carbon-Based Overcoats for Extremely High Density Magnetic Recording Yazar: Yeo, Reuben Jueyuan

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Lecture Notes in Real-Time Intelligent Systems

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Materials Handbook A Concise Desktop Reference / Yazar: Cardarelli, François

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Maritime Spatial Planning past, present, future /

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Materials for Advanced Packaging

İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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