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School-based interventions for struggling readers, K-8
Published 2013Full-text access
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Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /
Published 2018Table of Contents: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
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Polyoxometalate-Based Assemblies and Functional Materials
Published 2018Full-text access
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First RILEM International Conference on Concrete and Digital Fabrication - Digital Concrete 2018
Published 2019Table of Contents: “…Toussaint -- A Framework for Performance-based Testing of Fresh Mixtures for Construction-scale 3D Printing, by Ali Kazemian, Xiao Yuan, Ryan Meyer, and Berokh Khoshnevis -- Characterization of 3D Printing Mortars Made With OPC/CSA Mixes, by Noura Khalil, Sébastien Rémond, Bilal Baz, and Georges Aouad -- Rheological and water transport properties of cement pastes modified with diutan gum and attapulgite/palygorskite nanoclays for 3D concrete printing, by Siwei Ma, and Shiho Kawashima -- Rheological Control of 3D Printable Cement Paste and Mortars, by Scott Z. …”
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Polymer Synthesis Based on Triple-bond Building Blocks
Published 2018Full-text access
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Maritime Spatial Planning past, present, future /
Published 2019Full-text access
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Triboluminescence Theory, Synthesis, and Application /
Published 2016Full-text access
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Materials for Advanced Packaging
Published 2017Table of Contents: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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