Arama Sonuçları - (( (past OR most) to feed materials. ) OR ( (past OR most) to based materials. ))*
Önerilen Konular
Önerilen Konular
- Materials 38
- Analysis 27
- Characterization and Analytical Technique 27
- Polymers 26
- Materials Engineering 22
- Mechanics, Applied 22
- Building materials 20
- Biomaterials 19
- Optical Materials 18
- Optical materials 18
- Structural Materials 18
- Metals 16
- Metals and Alloys 16
- Nanotechnology 16
- Solid Mechanics 16
- Solids 16
- Ceramic materials 14
- Ceramics 14
- Computational Intelligence 14
- Computational intelligence 14
- Artificial Intelligence 13
- Artificial intelligence 13
- Signal processing 13
- Signal, Speech and Image Processing 13
- Telecommunication 12
- Biomedical Engineering and Bioengineering 11
- Biomedical engineering 11
- Aerospace Technology and Astronautics 10
- Aerospace engineering 10
- Astronautics 10
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Special education past, present, and future perspectives from the field /
Baskı/Yayın Bilgisi 2014Full-text access
OPAC'ta görüntüle
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2
Polysaccharide Based Hybrid Materials Metals and Metal Oxides, Graphene and Carbon Nanotubes /
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
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3
Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /
Baskı/Yayın Bilgisi 2018İçindekiler: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
Full-text access
OPAC'ta görüntüle
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4
Physics and Chemistry of Carbon-Based Materials Basics and Applications /
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
5
Polyoxometalate-Based Assemblies and Functional Materials
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
6
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Extraction 2018 Proceedings of the First Global Conference on Extractive Metallurgy /
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
8
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10
Polymer Synthesis Based on Triple-bond Building Blocks
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
11
Empirical nursing : the art of evidence-based care /
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
12
Cellulose-Based Superabsorbent Hydrogels
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
13
Bio-Based Materials as Applicable, Accessible, and Affordable Healthcare Solutions
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
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14
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15
Structural Materials Properties and Selection /
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
16
Maritime Spatial Planning past, present, future /
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
17
Materials for Advanced Packaging
Baskı/Yayın Bilgisi 2017İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
Full-text access
OPAC'ta görüntüle
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