Arama Sonuçları - (( fast to (read OR real) materials. ) OR (( easy OR past) to based materials. ))
Önerilen Konular
Önerilen Konular
- Materials 19
- Polymers 13
- TECHNOLOGY & ENGINEERING 13
- Analysis 11
- Characterization and Analytical Technique 11
- Materials Engineering 9
- Computational Intelligence 8
- Computational intelligence 8
- Mechanics, Applied 7
- Metals 7
- Metals and Alloys 7
- Optical Materials 7
- Optical materials 7
- Signal processing 7
- Signal, Speech and Image Processing 7
- Telecommunication 7
- Biomaterials 6
- Building materials 6
- Catalysis 6
- Artificial Intelligence 5
- Artificial intelligence 5
- Building Materials 5
- Communications Engineering, Networks 5
- Electronic Circuits and Systems 5
- Electronic circuits 5
- Electronics 5
- Electronics and Microelectronics, Instrumentation 5
- SCIENCE 5
- Structural Materials 5
- Ceramic materials 4
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Special education past, present, and future perspectives from the field /
Baskı/Yayın Bilgisi 2014Full-text access
OPAC'ta görüntüle
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2
Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /
Baskı/Yayın Bilgisi 2018İçindekiler: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
Full-text access
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e-Kitap -
3
Physics and Chemistry of Carbon-Based Materials Basics and Applications /
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
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4
Polyoxometalate-Based Assemblies and Functional Materials
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
5
Dielectric materials for electrical engineering /
Baskı/Yayın Bilgisi 2013Full-text access
OPAC'ta görüntüle
e-Kitap -
6
Catalytic process development for renewable materials /
Baskı/Yayın Bilgisi 2013Full-text access
OPAC'ta görüntüle
e-Kitap -
7
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Introduction to polymer rheology /
Baskı/Yayın Bilgisi 2012Full-text access
OPAC'ta görüntüle
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9
Ultrathin Carbon-Based Overcoats for Extremely High Density Magnetic Recording
Baskı/Yayın Bilgisi 2017Full-text access
OPAC'ta görüntüle
e-Kitap -
10
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11
Design and analysis of composite structures : with applications to aerospace structures /
Baskı/Yayın Bilgisi 2013Full-text access
OPAC'ta görüntüle
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12
Multifunctional nanocomposites for energy and environmental applications /
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
13
Maritime Spatial Planning past, present, future /
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
14
Bioceramics with clinical applications /
Baskı/Yayın Bilgisi 2014Full-text access
OPAC'ta görüntüle
e-Kitap -
15
Nanoelectronic Materials and Devices Select Proceedings of ICNETS2, Volume III /
Baskı/Yayın Bilgisi 2018Full-text access
OPAC'ta görüntüle
e-Kitap -
16
Materials for Advanced Packaging
Baskı/Yayın Bilgisi 2017İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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17
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19
Industrial Applications of Renewable Biomass Products Past, Present and Future /
Baskı/Yayın Bilgisi 2017İçindekiler: “…Industrial Applications of Renewable Biomass Products - Past, Present and Future -- Chapter 4. Innovative systems from clickable biopolymer-Based hydrogels for drug delivery -- Chapter 5. …”
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e-Kitap -
20
Extrusion-Cooking Techniques : Applications, Theory and Sustainability.
Baskı/Yayın Bilgisi 2011Full-text access
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e-Kitap