Arama Sonuçları - Ambach~
Önerilen Konular
Önerilen Konular
- Computational Intelligence 12
- Computational intelligence 12
- Sociology 10
- Telecommunication 9
- Aerospace Technology and Astronautics 8
- Aerospace engineering 8
- Artificial intelligence 8
- Astronautics 8
- Communications Engineering, Networks 8
- Data processing 8
- Artificial Intelligence 7
- Electronic Circuits and Systems 7
- Electronic circuits 7
- Electronics 7
- Electronics and Microelectronics, Instrumentation 7
- Engineering Fluid Dynamics 7
- Fluid mechanics 7
- Mathematics 7
- Signal processing 7
- Signal, Speech and Image Processing 7
- Social Science 7
- Continuum Mechanics 6
- Continuum mechanics 6
- Data mining 6
- Mechanics, Applied 6
- Data Mining and Knowledge Discovery 5
- General 5
- Multibody Systems and Mechanical Vibrations 5
- Multibody systems 5
- Physics 5
-
1
Becoming attached : first relationships and how they shape our capacity to love /
Baskı/Yayın Bilgisi 1998Konular: Publisher description
OPAC'ta görüntüle
Kitap -
2
-
3
-
4
-
5
-
6
-
7
-
8
-
9
Electromagnetic Linear Machines with Dual Halbach Array Design and Analysis /
Baskı/Yayın Bilgisi 2017Full-text access
OPAC'ta görüntüle
e-Kitap -
10
Nanotechnology for Defence Applications
Baskı/Yayın Bilgisi 2019Full-text access
OPAC'ta görüntüle
e-Kitap -
11
-
12
-
13
The circle of security intervention : enhancing attachment in early parent-child relationships /
Baskı/Yayın Bilgisi 2014Konular: “…Attachment behavior in children. 55002…”
OPAC'ta görüntüle
Kitap -
14
-
15
-
16
-
17
-
18
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /
Baskı/Yayın Bilgisi 2019İçindekiler: “…Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.…”
Full-text access
OPAC'ta görüntüle
e-Kitap -
19
Karar destek sistemleri : (Veri Ambarı - veri madenciliği - klinik KDS) /
Baskı/Yayın Bilgisi 2020OPAC'ta görüntüle
Kitap -
20
İnsan ilişkilerinin nörobilimi : Bağlanma ve sosyal beynin gelişimi /
Baskı/Yayın Bilgisi 2014Konular: OPAC'ta görüntüle
Kitap