Arama Sonuçları - packaging application,
Önerilen Konular
Önerilen Konular
- Food Science 22
- Electronic Circuits and Systems 18
- Electronic circuits 18
- Food science 18
- Polymers 15
- Materials 14
- Analysis 13
- Electronics 13
- Electronics and Microelectronics, Instrumentation 13
- Characterization and Analytical Technique 11
- Chemistry, Organic 9
- Optical Materials 9
- Optical materials 9
- Organic Chemistry 9
- Biomaterials 8
- Biotechnology 8
- Computational Intelligence 8
- Computational intelligence 8
- Data processing 8
- Food 8
- Mechanics, Applied 8
- Microelectromechanical systems 8
- Microsystems and MEMS 8
- Microtechnology 8
- Chemistry, Technical 7
- Industrial Chemistry 7
- Materials Engineering 7
- Artificial Intelligence 6
- Artificial intelligence 6
- Biomedical Engineering and Bioengineering 6
Şunu mu demek istediniz:
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1
Bionanocomposites for Packaging Applications
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.İçindekiler: “…Design and Fabrication of Softwood Cellulosic Nanocomposites for Packaging Applications -- Biopolymer Based Nanocomposites for Packaging Applications -- Manufacturing and Characterization of Sugar Palm Bioplastic Composites for Packaging -- Synthesis of Rice Husk/Nanoclay Based Bionanocomposites for Packaging application -- Green Biocomposites for Packaging applications -- Polysaccharides and Fibrous Clays Based Nanocomposites for Packaging applications -- Bionanocomposite films from Microfibrillated cellulose for Packaging Applications -- Natural Nanoscale Materials for Packaging Materials -- Bacterial Bellulose Based Sustainable Nanocomposite Films for Packaging Applications -- Perspectives of Bionanocomposites for Food Packaging Applications -- Clay Based Bionanocomposites for Food Packaging Applications -- Natural Biopolymer-Based Nanocomposite Films for Packaging Applications -- Proteins as Agricultural Polymers for Packaging Production -- Nanocomposites for Food Packaging Applications -- Rubber Based Nanocomposites for Packaging Applications.…”
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Modeling and Application of Flexible Electronics Packaging
Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2019.Full-text access
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4
Freeform optics for LED packages and applications /
Baskı/Yayın Bilgisi Wiley, 2017.İçindekiler: “…Front Matter -- Introduction -- Review of Main Algorithms of Freeform Optics for LED Lighting -- Basic Algorithms of Freeform Optics for LED Lighting -- Application-Specific LED Package Integrated with a Freeform Lens -- Freeform Optics for LED Indoor Lighting -- Freeform Optics for LED Road Lighting -- Freeform Optics for a Direct-Lit LED Backlighting Unit -- Freeform Optics for LED Automotive Headlamps -- Freeform Optics for Emerging LED Applications -- Freeform Optics for LED Lighting with High Spatial Color Uniformity -- Codes of Basic Algorithms of Freeform Optics for LED Lighting.…”
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5
3D Microelectronic Packaging From Fundamentals to Applications /
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2017.Full-text access
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6
Chitin- and chitosan-Based biocomposites for food packaging applications /
Baskı/Yayın Bilgisi CRC Press, Taylor & Francis Group, 2020.Kitap -
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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.Full-text access
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8
Materials for Advanced Packaging
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2017.İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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9
Composites materials for food packaging /
Baskı/Yayın Bilgisi Scrivener Publishing LLC, 2018.Full-text access
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Thermal Processing of Packaged Foods
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2016.İçindekiler: “…Heat Penetration in Packaged Foods -- 7. The General Method and Its Applications -- 8. …”
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12
Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /
Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2018.İçindekiler: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
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13
Fan-Out Wafer-Level Packaging
Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2018.Full-text access
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14
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.Full-text access
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15
Lignocellulosic Materials and Their Use in Bio-based Packaging
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.İçindekiler: “…Lignocellulosic materials: sources and extraction methods -- Functional properties of lignocellulosic materials -- Bio-based packaging materials -- Use of lignocellulosic materials for the development of bio-based packaging -- Main properties of bio-based packaging -- Bio-based packaging applications.…”
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16
Nanopackaging Nanotechnologies and Electronics Packaging /
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.İçindekiler: “…Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Advances in Delamination Modeling: Continuum Aspects -- Advances in Delamination Modeling: Atomistic Aspects -- Soft Mold Nano-imprint: Modeling and Simulation -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors -- Nanostructured Materials for Embedded Resistors -- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging -- Nanoparticles in Isotropic Conductive Adhesives -- Nano materials in Anisotropic Conductive Adhesives (ACAs) -- Nanoparticles in Microvias -- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging -- A Study of Nano Particles in SnAg-Based Lead Free Solders -- Nano-Underfills for Fine Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes -- Carbon Nanotubes for Thermal Management of Microsystems -- Nanowires in Electronics Packaging -- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection -- Synthesis and Optical Characterization of CVD Graphene -- Characterization of electronic, electrical, optical and mechanical properties of grapheme -- Graphene for Thermal Cooling of Microelectronics -- Carbon Interconnects -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Nanosensors for Electronics Package Reliability -- Applications of Bio-Nanotechnology to Electronics Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanotechnology Health, Safety, Environment Overview.…”
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17
Polymers for Food Applications
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.İçindekiler: “…Polymers for food applications - News -- Edible films -- The potential of vegetal and animal proteins to develop more sustainable food packaging -- Properties of micro- and nano-reinforced biopolymers for food applications -- Recent trends on nano-biocomposite polymers for food packaging -- Surface properties of biodegradable polymers for food packaging -- Transport phenomena in edible films -- Antimicrobial films and coatings incorporated with food preservatives of microbial origin -- Postharvest application of biopolymer-based edible coatings to improve the quality of fresh horticultural produce -- Edible foams stabilized by food-grade polymers -- Foams for food applications -- Biodegradable foams in the development of food packaging -- Composite foams made from edible and biodegradable polymers for food packaging applications -- Nano and microencapsulation using food grade polymers -- Food-grade biopolymers as efficient delivery systems for nutrients: An overview -- Current processing methods in the development of micro- and nanoencapsulation from edible polymers -- Biopolymers for the nano-microencapsulation of bioactive ingredients by electrohydrodynamic processing -- Food gel emulsions: structural characteristics and viscoelastic behavior -- Polymers for structure design of dairy foods -- Partially hydrolyzed guar gum: preparation & properties -- Development of hydrogels from edible polymers -- Food grade polymers for the gelation of edible oils envisioning food applications -- Current applications in food preservation based on marine biopolymers -- Functional carbohydrate polymers - Prebiotics -- Role of different polymers on the development of gluten-free baked goods -- 3D Food Printing - Perspectives -- Sensors based on conducting polymers for the analysis of food products.…”
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18
Finite Element Applications A Practical Guide to the FEM Process /
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.Full-text access
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19
Polymers for Agri-Food Applications
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.İçindekiler: “…Trends in polymers for agri-food applications: A note from the editor -- Polymer based micro- and nanoencapsulation of agrochemicals -- Nano and microencapsulated nutrients for enhanced efficiency fertilizer -- Potential use of polymeric particles for the regulation of plant growth -- Applications and implications of environmental-responsive polymers toward agrochemicals -- Starch nanoparticles and nanocrystals as bioactive molecule carriers -- Biopolymer-based hydrogels for agriculture applications: Swelling behavior and slow delivery of agrochemicals -- Hydrogels: An effective tool to improve nitrogen use efficiency in cops -- Classifications and uses of emulsion in food and agro applications -- Nanoemulsions: Industrial production and food-grade applications -- Biodegradable plastic mulch films for sustainable specialty crop production -- Performance of bio-based polymeric agricultural mulch films -- Agronomical overview of mulch film systems -- Mulch plastic systems: Recent advances and applications -- Biodegradable polymer nanofibers applied in slow release systems for agri-food applications -- Synthesis methods of starch-based polymer foams and its comparison with conventional polymer foams for food packaging applications -- Coatings in the postharvest -- Trends in coatings manufacturing in the postharvest preservation of fruits and vegetables -- Development of edible coatings in the preservation of fruits and vegetables: A critical discussion and exhaustive -- Smart and active edible coatings based on biopolymers -- Active and smart edible coatings for fresh fruits and vegetables -- Active, eco-friendly and edible coatings in the post-harvest - A critical discussion -- Chitosan mono- and bilayer edible coatings for preserving postharvest quality of fresh fruit -- Shellac-based coating polymer for agricultural applications -- Application of bionanocomposites on horticultural products to increase the shelf life -- Essential oil nanoemulsions as antimicrobials and antioxidants in composite food packaging -- Nanocellulose-polymer composites: Novel materials for food packaging applications -- Index.…”
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20
Materials Design and Applications II
Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.Full-text access
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