Arama Sonuçları - packaging application,

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  1. 1

    Bionanocomposites for Packaging Applications

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
    İçindekiler: “…Design and Fabrication of Softwood Cellulosic Nanocomposites for Packaging Applications -- Biopolymer Based Nanocomposites for Packaging Applications -- Manufacturing and Characterization of Sugar Palm Bioplastic Composites for Packaging -- Synthesis of Rice Husk/Nanoclay Based Bionanocomposites for Packaging application -- Green Biocomposites for Packaging applications -- Polysaccharides and Fibrous Clays Based Nanocomposites for Packaging applications -- Bionanocomposite films from Microfibrillated cellulose for Packaging Applications -- Natural Nanoscale Materials for Packaging Materials -- Bacterial Bellulose Based Sustainable Nanocomposite Films for Packaging Applications -- Perspectives of Bionanocomposites for Food Packaging Applications -- Clay Based Bionanocomposites for Food Packaging Applications -- Natural Biopolymer-Based Nanocomposite Films for Packaging Applications -- Proteins as Agricultural Polymers for Packaging Production -- Nanocomposites for Food Packaging Applications -- Rubber Based Nanocomposites for Packaging Applications.…”
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  2. 2

    Active packaging for food applications/ Yazar: Brody, Aaron L.

    Baskı/Yayın Bilgisi CRC Press, 2001
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  3. 3

    Modeling and Application of Flexible Electronics Packaging Yazar: Huang, YongAn, Yin, Zhouping, Wan, Xiaodong

    Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2019.
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  4. 4

    Freeform optics for LED packages and applications / Yazar: Wang, Kai, Liu, Sheng, Luo, Xiaobing, 1974-, Wu, Dan

    Baskı/Yayın Bilgisi Wiley, 2017.
    İçindekiler: “…Front Matter -- Introduction -- Review of Main Algorithms of Freeform Optics for LED Lighting -- Basic Algorithms of Freeform Optics for LED Lighting -- Application-Specific LED Package Integrated with a Freeform Lens -- Freeform Optics for LED Indoor Lighting -- Freeform Optics for LED Road Lighting -- Freeform Optics for a Direct-Lit LED Backlighting Unit -- Freeform Optics for LED Automotive Headlamps -- Freeform Optics for Emerging LED Applications -- Freeform Optics for LED Lighting with High Spatial Color Uniformity -- Codes of Basic Algorithms of Freeform Optics for LED Lighting.…”
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  5. 5

    3D Microelectronic Packaging From Fundamentals to Applications /

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2017.
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  6. 6

    Chitin- and chitosan-Based biocomposites for food packaging applications /

    Baskı/Yayın Bilgisi CRC Press, Taylor & Francis Group, 2020.
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  7. 7

    Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.
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  8. 8

    Materials for Advanced Packaging

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2017.
    İçindekiler: “…3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Fabrication and Applications to Wafer Level System Integration -- Advanced Substrates: A Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes -- Wafer Level Chip Scale Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability -- Flexible and Printed Electronics -- Silicon Solar Cell Metallization Pastes -- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices -- Characterization of Copper Diffusion in Through Silicon Vias.…”
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  9. 9

    Composites materials for food packaging /

    Baskı/Yayın Bilgisi Scrivener Publishing LLC, 2018.
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  10. 10

    Food and beverage packaging technology /

    Baskı/Yayın Bilgisi Wiley, [2011]
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  11. 11

    Thermal Processing of Packaged Foods Yazar: Holdsworth, S. Donald, Simpson, Ricardo

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2016.
    İçindekiler: “…Heat Penetration in Packaged Foods -- 7. The General Method and Its Applications -- 8. …”
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  12. 12

    Bio-based Materials for Food Packaging Green and Sustainable Advanced Packaging Materials /

    Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2018.
    İçindekiler: “…Bio-based Materials: Past -to-Future -- Interaction Phenomena Between Packaging and Product -- Testing Methods for Packaging Materials -- Functionality and Properties of Bio-based Materials -- Potential Bio-based Edible Films, Foams and Hydrogels for Food Packaging -- Nanotechnology and Edible Films for Food Packaging Applications -- Bionanocomposites in Packaging: Business Model for Products' Commercialisation -- Environmental Friendly Biopolymers for Food Packaging: Starch, Protein and Poly-Lactic Acid (PLA) -- Biodegradable Smart Biopolymers for Food Packaging: Sustainable Approach Towards Green Environment -- Biopolymers, Nanocomposites and Environmental Protection-a far-Reaching Review -- Chitosan Based Edible Membranes for Food Packaging -- Chitosan Based Nanocomposites in Food Packaging -- Application of Nanocomposites in Packaging- a far-Reaching Review and a Vision for the Future.…”
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  13. 13

    Fan-Out Wafer-Level Packaging Yazar: Lau, John H.

    Baskı/Yayın Bilgisi Springer Nature Singapore : Imprint: Springer, 2018.
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  14. 14

    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method / Yazar: Seok, Seonho

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
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  15. 15

    Lignocellulosic Materials and Their Use in Bio-based Packaging Yazar: Ballesteros, Lina Fernanda, Michelin, Michele, Vicente, António Augusto, Teixeira, José António, Cerqueira, Miguel Ângelo

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
    İçindekiler: “…Lignocellulosic materials: sources and extraction methods -- Functional properties of lignocellulosic materials -- Bio-based packaging materials -- Use of lignocellulosic materials for the development of bio-based packaging -- Main properties of bio-based packaging -- Bio-based packaging applications.…”
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  16. 16

    Nanopackaging Nanotechnologies and Electronics Packaging /

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
    İçindekiler: “…Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Advances in Delamination Modeling: Continuum Aspects -- Advances in Delamination Modeling: Atomistic Aspects -- Soft Mold Nano-imprint: Modeling and Simulation -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors -- Nanostructured Materials for Embedded Resistors -- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging -- Nanoparticles in Isotropic Conductive Adhesives -- Nano materials in Anisotropic Conductive Adhesives (ACAs) -- Nanoparticles in Microvias -- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging -- A Study of Nano Particles in SnAg-Based Lead Free Solders -- Nano-Underfills for Fine Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes -- Carbon Nanotubes for Thermal Management of Microsystems -- Nanowires in Electronics Packaging -- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection -- Synthesis and Optical Characterization of CVD Graphene -- Characterization of electronic, electrical, optical and mechanical properties of grapheme -- Graphene for Thermal Cooling of Microelectronics -- Carbon Interconnects -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Nanosensors for Electronics Package Reliability -- Applications of Bio-Nanotechnology to Electronics Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanotechnology Health, Safety, Environment Overview.…”
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  17. 17

    Polymers for Food Applications

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
    İçindekiler: “…Polymers for food applications - News -- Edible films -- The potential of vegetal and animal proteins to develop more sustainable food packaging -- Properties of micro- and nano-reinforced biopolymers for food applications -- Recent trends on nano-biocomposite polymers for food packaging -- Surface properties of biodegradable polymers for food packaging -- Transport phenomena in edible films -- Antimicrobial films and coatings incorporated with food preservatives of microbial origin -- Postharvest application of biopolymer-based edible coatings to improve the quality of fresh horticultural produce -- Edible foams stabilized by food-grade polymers -- Foams for food applications -- Biodegradable foams in the development of food packaging -- Composite foams made from edible and biodegradable polymers for food packaging applications -- Nano and microencapsulation using food grade polymers -- Food-grade biopolymers as efficient delivery systems for nutrients: An overview -- Current processing methods in the development of micro- and nanoencapsulation from edible polymers -- Biopolymers for the nano-microencapsulation of bioactive ingredients by electrohydrodynamic processing -- Food gel emulsions: structural characteristics and viscoelastic behavior -- Polymers for structure design of dairy foods -- Partially hydrolyzed guar gum: preparation & properties -- Development of hydrogels from edible polymers -- Food grade polymers for the gelation of edible oils envisioning food applications -- Current applications in food preservation based on marine biopolymers -- Functional carbohydrate polymers - Prebiotics -- Role of different polymers on the development of gluten-free baked goods -- 3D Food Printing - Perspectives -- Sensors based on conducting polymers for the analysis of food products.…”
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  18. 18

    Finite Element Applications A Practical Guide to the FEM Process / Yazar: Okereke, Michael, Keates, Simeon

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2018.
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  19. 19

    Polymers for Agri-Food Applications

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.
    İçindekiler: “…Trends in polymers for agri-food applications: A note from the editor -- Polymer based micro- and nanoencapsulation of agrochemicals -- Nano and microencapsulated nutrients for enhanced efficiency fertilizer -- Potential use of polymeric particles for the regulation of plant growth -- Applications and implications of environmental-responsive polymers toward agrochemicals -- Starch nanoparticles and nanocrystals as bioactive molecule carriers -- Biopolymer-based hydrogels for agriculture applications: Swelling behavior and slow delivery of agrochemicals -- Hydrogels: An effective tool to improve nitrogen use efficiency in cops -- Classifications and uses of emulsion in food and agro applications -- Nanoemulsions: Industrial production and food-grade applications -- Biodegradable plastic mulch films for sustainable specialty crop production -- Performance of bio-based polymeric agricultural mulch films -- Agronomical overview of mulch film systems -- Mulch plastic systems: Recent advances and applications -- Biodegradable polymer nanofibers applied in slow release systems for agri-food applications -- Synthesis methods of starch-based polymer foams and its comparison with conventional polymer foams for food packaging applications -- Coatings in the postharvest -- Trends in coatings manufacturing in the postharvest preservation of fruits and vegetables -- Development of edible coatings in the preservation of fruits and vegetables: A critical discussion and exhaustive -- Smart and active edible coatings based on biopolymers -- Active and smart edible coatings for fresh fruits and vegetables -- Active, eco-friendly and edible coatings in the post-harvest - A critical discussion -- Chitosan mono- and bilayer edible coatings for preserving postharvest quality of fresh fruit -- Shellac-based coating polymer for agricultural applications -- Application of bionanocomposites on horticultural products to increase the shelf life -- Essential oil nanoemulsions as antimicrobials and antioxidants in composite food packaging -- Nanocellulose-polymer composites: Novel materials for food packaging applications -- Index.…”
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  20. 20

    Materials Design and Applications II

    Baskı/Yayın Bilgisi Springer International Publishing : Imprint: Springer, 2019.
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