Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips an...

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Bibliographic Details
Main Author: Yazdani, Farhang (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2018.
Edition:1st ed. 2018.
Subjects:
Electronic circuits.
Electronics.
Electronic Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Online Access:Full-text access
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Table of Contents:
  • Introduction
  • Wirebond Physical Implementation
  • Flip-Chip Physical Implementation
  • Substrate Physical Implementation
  • Conventional Design Flow
  • Pathfinding and Co-Design.

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