Modeling and Application of Flexible Electronics Packaging

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...

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Bibliographic Details
Main Authors: Huang, YongAn (Author), Yin, Zhouping (Author), Wan, Xiaodong (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Singapore : Springer Nature Singapore : 2019.
Imprint: Springer,
Edition:1st ed. 2019.
Subjects:
Electronics.
Optical materials.
Manufactures.
Mechanics, Applied.
Computer simulation.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Machines, Tools, Processes.
Engineering Mechanics.
Computer Modelling.
Online Access:Full-text access
Table of Contents:
  • Advanced Electronics Packaging
  • Interfacial Modeling of Flexible Multilayer Structures
  • Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy
  • Shear-Assisted Peeling
  • Single-Needle Peeling
  • Multi-Needle Peeling
  • Conformal Peeling
  • Laser Lift-Off
  • Vacuum-Based Picking-up and Placing-on.

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