Materials for Advanced Packaging

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Lu, Daniel (Editör), Wong, C.P (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edisyon:2nd ed. 2017.
Konular:
Electronics.
Microtechnology.
Microelectromechanical systems.
Metals.
Optical materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microsystems and MEMS.
Metals and Alloys.
Optical Materials.
Electronic Circuits and Systems.
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