SpringerLink (Online service), Lu, D., & Wong, C. (2017). Materials for Advanced Packaging (2nd ed. 2017.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-319-45098-8
Chicago Style (17th ed.) CitationSpringerLink (Online service), Daniel Lu, and C.P Wong. Materials for Advanced Packaging. 2nd ed. 2017. Cham: Springer International Publishing : Imprint: Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
MLA (9th ed.) CitationSpringerLink (Online service), et al. Materials for Advanced Packaging. 2nd ed. 2017. Springer International Publishing : Imprint: Springer, 2017. https://doi.org/10.1007/978-3-319-45098-8.
Warning: These citations may not always be 100% accurate.