Yüklüyor…
Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...
| Müşterek Yazar: | |
|---|---|
| Diğer Yazarlar: | , |
| Materyal Türü: | e-Kitap |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Cham :
Springer International Publishing :
2017.
Imprint: Springer, |
| Edisyon: | 2nd ed. 2017. |
| Konular: | |
| Online Erişim: | Full-text access |
İçindekiler:
- 3D Integration Technologies - An Overview
- Advanced Bonding/Joining Techniques
- Advanced Chip-to-Substrate Connections
- Advanced Wire Bonding Technology: Materials, Methods, and Testing
- Lead-Free Soldering
- Thin Die Fabrication and Applications to Wafer Level System Integration
- Advanced Substrates: A Materials and Processing Perspective
- Flip-Chip Underfill: Materials, Process and Reliability
- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
- Electrically Conductive Adhesives (ECAs)
- Die Attach Adhesives and Films
- Thermal Interface Materials
- Embedded Passives
- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes
- Wafer Level Chip Scale Packaging
- MEMS Packaging
- LED Die Bonding
- Medical Electronics Design, Manufacturing, and Reliability
- Flexible and Printed Electronics
- Silicon Solar Cell Metallization Pastes
- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices
- Characterization of Copper Diffusion in Through Silicon Vias.