Systems-Level Packaging for Millimeter-Wave Transceivers

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able...

Ful tanımlama

Detaylı Bibliyografya
Asıl Yazarlar: Božanić, Mladen (Yazar), Sinha, Saurabh (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : Imprint: Springer, 2019.
Edisyon:1st ed. 2019.
Seri Bilgileri:Smart Sensors, Measurement and Instrumentation, 34
Konular:
Wireless communication systems.
Mobile communication systems.
Engineering design.
Cooperating objects (Computer systems).
Wireless and Mobile Communication.
Engineering Design.
Cyber-Physical Systems.
Online Erişim:Full-text access
OPAC'ta görüntüle

Internet

Full-text access
OPAC'ta görüntüle

Merkez Kütüphane

Detaylı Erişim Bilgileri Merkez Kütüphane
Kopya Bilgisi UnknownBarcode

Benzer Materyaller