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Systems-Level Packaging for Millimeter-Wave Transceivers

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able...

Detaylı Bibliyografya
Asıl Yazarlar:	Božanić, Mladen (Yazar), Sinha, Saurabh (Yazar)
Müşterek Yazar:	SpringerLink (Online service)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : 2019. Imprint: Springer,
Edisyon:	1st ed. 2019.
Seri Bilgileri:	Smart Sensors, Measurement and Instrumentation, 34
Konular:	Wireless communication systems. Mobile communication systems. Engineering design. Cooperating objects (Computer systems). Wireless and Mobile Communication. Engineering Design. Cyber-Physical Systems.
Online Erişim:	Full-text access

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