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Systems-Level Packaging for Millimeter-Wave Transceivers
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able...
| Asıl Yazarlar: | , |
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| Müşterek Yazar: | |
| Materyal Türü: | e-Kitap |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Cham :
Springer International Publishing :
2019.
Imprint: Springer, |
| Edisyon: | 1st ed. 2019. |
| Seri Bilgileri: | Smart Sensors, Measurement and Instrumentation,
34 |
| Konular: | |
| Online Erişim: | Full-text access |
İçindekiler:
- Introduction and Research Impact
- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies
- Integrated Substrates: Millimeter-Wave Transistor Technologies
- Discrete Substrates: Package Foundation
- Traditional Approach: System-on-Chip
- Multi-Chip Modules and Multi-Chip Packaging
- State-of-the-Art Approach: System-on-Package
- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.