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Systems-Level Packaging for Millimeter-Wave Transceivers
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able...
Main Authors: | , |
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Corporate Author: | |
Format: | e-Book |
Language: | English |
Published: |
Cham :
Springer International Publishing :
2019.
Imprint: Springer, |
Edition: | 1st ed. 2019. |
Series: | Smart Sensors, Measurement and Instrumentation,
34 |
Subjects: | |
Online Access: | Full-text access |
Internet
Full-text accessMerkez Kütüphane
Copy | UnknownBarcode |
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