Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

Ful tanımlama

Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Siow, Kim S. (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2019.
Imprint: Springer,
Edisyon:1st ed. 2019.
Konular:
Optical materials.
Electronics.
Metals.
Materials > Analysis.
Materials.
Security systems.
Optical Materials.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Characterization and Analytical Technique.
Materials Engineering.
Security Science and Technology.
Online Erişim:Full-text access

Internet

Full-text access

Merkez Kütüphane

Detaylı Erişim Bilgileri Merkez Kütüphane
Kopya Bilgisi UnknownBarcode

Benzer Materyaller