APA (7. basım) Alıntı

SpringerLink (Online service) & Siow, K. S. (2019). Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability (1st ed. 2019.). Springer International Publishing. https://doi.org/10.1007/978-3-319-99256-3

Chicago Style (17. basım) Atıf

SpringerLink (Online service) ve Kim S. Siow. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. 1st ed. 2019. Cham: Springer International Publishing, 2019. https://doi.org/10.1007/978-3-319-99256-3.

MLA (9th ed.) Atıf

SpringerLink (Online service) ve Kim S. Siow. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. 1st ed. 2019. Springer International Publishing, 2019. https://doi.org/10.1007/978-3-319-99256-3.