Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Siow, Kim S. (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2019.
Edition:1st ed. 2019.
Subjects:
Optical materials.
Electronics.
Metals.
Materials > Analysis.
Materials.
Security systems.
Optical Materials.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Characterization and Analytical Technique.
Materials Engineering.
Security Science and Technology.
Online Access:Full-text access
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Description
Summary:This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Physical Description:XX, 279 p. 175 illus., 122 illus. in color. online resource.
ISBN:9783319992563
DOI:10.1007/978-3-319-99256-3

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