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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...
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| Format: | e-Book |
| Language: | English |
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Cham :
Springer International Publishing : Imprint: Springer,
2019.
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| Edition: | 1st ed. 2019. |
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| Online Access: | Full-text access View in OPAC |