Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Siow, Kim S. (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2019.
Imprint: Springer,
Edisyon:1st ed. 2019.
Konular:
Optical materials.
Electronics.
Metals.
Materials > Analysis.
Materials.
Security systems.
Optical Materials.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Characterization and Analytical Technique.
Materials Engineering.
Security Science and Technology.
Online Erişim:Full-text access
İçindekiler:
  • Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison
  • Chapter 2: Sintered Silver for LED Applications
  • Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications
  • Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials
  • Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint
  • Chapter6: Morphological changes in sintered silver due to atomic migration
  • Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials
  • Chapter 8: Sintered Copper : Chemistry, Process and Reliability
  • Chapter 9: Transient Liquid Phase Bonding
  • Chapter 10: Die attach materials for extreme conditions and harsh environments.

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