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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

Detaylı Bibliyografya
Yazar:	Seok, Seonho (Yazar)
Müşterek Yazar:	SpringerLink (Online service)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : 2018. Imprint: Springer,
Edisyon:	1st ed. 2018.
Seri Bilgileri:	Springer Series in Advanced Manufacturing,
Konular:	Manufactures. Nanotechnology. Microtechnology. Microelectromechanical systems. Materials > Analysis. Coatings. Tribology. Machines, Tools, Processes. Microsystems and MEMS. Characterization and Analytical Technique.
Online Erişim:	Full-text access

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