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3D Stacked Chips From Emerging Processes to Heterogeneous Systems /
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus...
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| Other Authors: | , |
| Format: | e-Book |
| Language: | English |
| Published: |
Cham :
Springer International Publishing :
2016.
Imprint: Springer, |
| Edition: | 1st ed. 2016. |
| Subjects: | |
| Online Access: | Full-text access |
| Summary: | This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; •Includes discussion of 3D integration of high-density power sources and novel NVM. |
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| Physical Description: | XXIII, 339 p. 238 illus., 157 illus. in color. online resource. |
| ISBN: | 9783319204819 |
| DOI: | 10.1007/978-3-319-20481-9 |