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3D Stacked Chips From Emerging Processes to Heterogeneous Systems /

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus...

Detaylı Bibliyografya
Müşterek Yazar:	SpringerLink (Online service)
Diğer Yazarlar:	Elfadel, Ibrahim (Abe) M. (Editör), Fettweis, Gerhard (Editör)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : 2016. Imprint: Springer,
Edisyon:	1st ed. 2016.
Konular:	Electronic circuits. Microprocessors. Computer architecture. Electronic Circuits and Systems. Processor Architectures.
Online Erişim:	Full-text access

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