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3D Stacked Chips From Emerging Processes to Heterogeneous Systems /
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus...
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| Other Authors: | , |
| Format: | e-Book |
| Language: | English |
| Published: |
Cham :
Springer International Publishing :
2016.
Imprint: Springer, |
| Edition: | 1st ed. 2016. |
| Subjects: | |
| Online Access: | Full-text access |