3D Stacked Chips From Emerging Processes to Heterogeneous Systems /

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Elfadel, Ibrahim (Abe) M. (Editor), Fettweis, Gerhard (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2016.
Imprint: Springer,
Edition:1st ed. 2016.
Subjects:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Online Access:Full-text access

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