3D Microelectronic Packaging From Fundamentals to Applications /

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Li, Yan (Editör), Goyal, Deepak (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edisyon:1st ed. 2017.
Seri Bilgileri:Springer Series in Advanced Microelectronics, 57
Konular:
Electronics.
Optical materials.
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Metals.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Electronic Circuits and Systems.
Microsystems and MEMS.
Metals and Alloys.
Online Erişim:Full-text access

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