APA (7. basım) Alıntı

SpringerLink (Online service), Li, Y., & Goyal, D. (2017). 3D Microelectronic Packaging: From Fundamentals to Applications (1st ed. 2017.). Springer International Publishing. https://doi.org/10.1007/978-3-319-44586-1

Chicago Style (17. basım) Atıf

SpringerLink (Online service), Yan Li, ve Deepak Goyal. 3D Microelectronic Packaging: From Fundamentals to Applications. 1st ed. 2017. Cham: Springer International Publishing, 2017. https://doi.org/10.1007/978-3-319-44586-1.

MLA (9th ed.) Atıf

SpringerLink (Online service), et al. 3D Microelectronic Packaging: From Fundamentals to Applications. 1st ed. 2017. Springer International Publishing, 2017. https://doi.org/10.1007/978-3-319-44586-1.