Carbon Nanotubes for Interconnects Process, Design and Applications /

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Todri-Sanial, Aida (Editör), Dijon, Jean (Editör), Maffucci, Antonio (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edisyon:1st ed. 2017.
Konular:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Online Erişim:Full-text access
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