Carbon Nanotubes for Interconnects Process, Design and Applications /

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Todri-Sanial, Aida (Editor), Dijon, Jean (Editor), Maffucci, Antonio (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edition:1st ed. 2017.
Subjects:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Online Access:Full-text access
Description
Summary:This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
Physical Description:XII, 333 p. 167 illus., 133 illus. in color. online resource.
ISBN:9783319297460
DOI:10.1007/978-3-319-29746-0

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