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Carbon Nanotubes for Interconnects Process, Design and Applications /

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

Detaylı Bibliyografya
Müşterek Yazar:	SpringerLink (Online service)
Diğer Yazarlar:	Todri-Sanial, Aida (Editör), Dijon, Jean (Editör), Maffucci, Antonio (Editör)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : 2017. Imprint: Springer,
Edisyon:	1st ed. 2017.
Konular:	Electronic circuits. Microprocessors. Computer architecture. Electronic Circuits and Systems. Processor Architectures.
Online Erişim:	Full-text access

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