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Carbon Nanotubes for Interconnects Process, Design and Applications /
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
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| Other Authors: | , , |
| Format: | e-Book |
| Language: | English |
| Published: |
Cham :
Springer International Publishing :
2017.
Imprint: Springer, |
| Edition: | 1st ed. 2017. |
| Subjects: | |
| Online Access: | Full-text access |