Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...

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Detaylı Bibliyografya
Yazar: Zhang, Qingke (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016.
Edisyon:1st ed. 2016.
Seri Bilgileri:Springer Theses, Recognizing Outstanding Ph.D. Research,
Konular:
Mechanics, Applied.
Solids.
Surfaces (Technology).
Thin films.
Mechanics.
Materials > Analysis.
Solid Mechanics.
Surfaces, Interfaces and Thin Film.
Classical Mechanics.
Characterization and Analytical Technique.
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