Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...

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Detaylı Bibliyografya
Yazar: Cheng, Jie (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Singapore : Springer Nature Singapore : 2018.
Imprint: Springer,
Edisyon:1st ed. 2018.
Seri Bilgileri:Springer Theses, Recognizing Outstanding Ph.D. Research,
Konular:
Manufactures.
Coatings.
Tribology.
Corrosion and anti-corrosives.
Electronics.
Machines, Tools, Processes.
Corrosion.
Electronics and Microelectronics, Instrumentation.
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